Hyaluronic Acid Serum 100 kDa

Here is the very simple formula to make our Hyaluronic Acid Serum 100KDa with a molecular weight of approximately 100,000 Daltons (100 kDa) based on Dr. Fukaya’s Skin Repair Lotion. This formula makes a 2% solution that can be used on the skin as is, or added as an ingredient in other cosmetic formulations.  This formula contains our Hyaluronic Acid ELMW, with an average molecular weight of 100 kDa and is preserved with Leucidal Liquid, a natural preservative. 

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Hyaluronic Acid Serum 100 kDa

 

Formula

 

Percent

Grams

 

   Ingredient

Single Phase

96.0

96.0

  

   Distilled Water

 

  2.0

  2.0

   Leucidal Liquid or Leucidal SF Max

 

  2.0

  2.0

  

   Hyaluronic Acid ELMW (80,000-110,000 Da)

 

1. Combine Distilled Water, Leucidal Liquid and stir to mix.

2. Sprinkle Hyaluronic Acid on surface of water and mix well with paddle mixer from time to time until mixture is smooth and evenly hydrated (this can take up to 45 minutes). Alternately, you can sprinkle the Hyaluronic Acid on top of and the water, mix it in and let it sit for up to 3 hours to fully hydrate and then mix it again until the mixture is thick and of a uniform consistency.  With either method, white clumps or streaks of Hyaluronic Acid ELMW powder will disappear and the mixture will thicken when it is fully hydrated.

Makes approximately 100 grams or 3.5 ounces of serum.

INCI: Water, Leuconostoc/Radish Root Ferment Filtrate, Sodium Hyaluronate

Ingredients in bold are carried by Lotioncrafter                                  © Lotioncrafter 2016  All Rights Reserved

The information given and the recommendations made herein are based on our research and are believed to be accurate but no guarantee of their accuracy is made and we assume no liability regarding this formula or information contained herein.  In every case we urge and recommend that our customers make their own tests to determine to their own satisfaction whether the product is suitable for their particular purposes under their own operating conditions.  Nothing contained herein shall be construed to imply the nonexistence of any relevant patents or to constitute a permission, inducement or recommendation to practice any invention covered by any patent, without the authority from the owner of this patent.
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